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Scholarships

The CUNA Technology Council is pleased to offer the Dan Riley Memorial Scholarship to qualifying candidates interested in attending the CUNA Technology Council Credit Union Technology Summit. This year's Summit will be held July 30 - August 2, 2008 at the Williamsburg Lodge in Colonial Williamsburg, VA.

The scholarship will provide one recipient with a complimentary registration to the CUNA Technology Council Summit plus up to $1,500 in travel and conference-related expenses. Also included with the scholarship is a one-year membership to the CUNA Technology Council.

Eligibility

To be considered as a potential scholarship recipient, applicants must meet the following requirements:

  1. Be a current member of the CUNA Technology Council, or be recommended by a current CTC member;
  2. Be affiliated with the credit union system;
  3. Be a full-time employee of the credit union who has primary responsibility for the credit union's IT department;
  4. Be willing and able to take an active role in the CTC and the conference which may include serving on at least one CTC committee, helping with conference registration, assisting a speaker, or assisting where needed during the CTC conference; and
  5. Be able to demonstrate a financial need.

Selection Criteria

The scholarship committee, led by Jackie Buchanan of T&C FCU will select the winner based on financial need and commitment to the IT profession.

Application Procedures

With your completed application form, submit the following:

  1. A 200 (maximum)-word essay demonstrating your financial need and commitment to the IT profession. The essay must also express technology's role in achieving the vision for your credit union and how your continuing professional development will contribute toward the achievement of this vision and fulfillment of your credit union's IT goals.
  2. A resume detailing your work experience and education (including formal and specialized). Please include any extracurricular activities (e.g. committees, chapter, league, or community involvement), and awards (inside or outside the credit union industry) in which you are involved.
  3. A reference letter from the applicant's CEO attesting to the need for financial aid and the qualifications of the applicant, along with a showing of support for allowing the individual to become involved in a professional organization.

Deadline

The application and collateral materials must be received no later than June 11, 2008.

All applications and collateral materials should be sent to:

Bobbi Bischke
CUNA Technology Council
PO Box 431
Madison, WI 53701
Telephone: 800-356-9655, ext. 4018
Email: bbischke@cuna.com